Copper (Cu)
Copper has been mined for 5,000 years. It is a reddish metal that takes on a bright luster. Malleable and ductile, it is a good conductor of heat and electricity.
Copper can occur naturally in large ore deposits of sulfides, oxides, and carbonates. It is also found in cuprite, malachite, azurite, chalcopyrite, bornite, and other minerals.
Copper's largest use is in the electrical industry, and its alloys, brass and bronze, are used in coins and gun metals. Copper is also used as both an agricultural poison and an algaecide. Copper compounds are widely used in analytical chemistry testing.
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Filtered Search Results
| Name Note | 0.5mm (0.02 in.) dia. |
|---|---|
| Form | Wire |
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Solubility Information | Insoluble in water. |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Copper Nickel wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Weight | ≈1.75g/m |
| Avg. Mol. Wt. or Mol. Wt. Range | Cu:Ni 55:45 wt% |
Copper sputtering target, 76.2mm (3.0 in.) dia. x 3.18mm (0.125 in.) thick, 99.995% (metals basis), Thermo Scientific™
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper wire, 0.64mm (0.025in) dia, Puratronic™, 99.999% (metals basis), Oxygen free
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper Metal, Light, Turnings, Spectrum™ Chemical
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CAS: 7440-50-8 Molecular Weight (g/mol): 63.54
| CAS | 7440-50-8 |
|---|---|
| Molecular Weight (g/mol) | 63.54 |
Copper wire, 0.1mm (0.004in) dia, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.1mm (0.004in) thick, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
| Form | Liquid |
|---|---|
| MDL Number | MFCD00161912 |
| Health Hazard 1 | H290-H302-H315-H317-H318 |
| DOT Information | Hazard Class: 8; Packaging Group: III |
| Chemical Name or Material | Copper etchant |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Density | 1.19 |
| Name Note | 6.3mm (0.25 in.) dia. x 61cm (24 in.) long |
|---|---|
| Percent Purity | 99% |
| MDL Number | MFCD00144065 |
| Chemical Name or Material | Graphite rod |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| EINECS Number | 231-955-3 |
| Assay Percent Notes | (metals basis) |
| Weight | ≈40g/pc |
Copper wire, 1.0mm (0.04in) dia, Puratronic™, 99.999% (metals basis), Oxygen free
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper wire, 1.0mm (0.04in) dia, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper turnings, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper shot, 3-6mm (0.12-0.24in), Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper Metal, Shot, 99.9%, Spectrum™ Chemical
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Small and/or specialty supplier based on Federal laws and SBA requirements.
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Small and/or specialty supplier based on Federal laws and SBA requirements.
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CAS: 7440-50-8 Molecular Weight (g/mol): 63.54
| CAS | 7440-50-8 |
|---|---|
| Molecular Weight (g/mol) | 63.54 |
Copper shot, 1-10mm (0.04-0.4in), 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |